MEMS expertise
- dynamic MEMS devices and inertial sensors
- complete development cycle
- conceptual development
- design and layout
- fabrication and packaging
- experimental characterization
- novel detection and control schemes
Experimental experience
- design and optimization of experiments for characterization of MEMS
- dynamics in controllable pressue and temperature environment
- deterministic and random drift performance
- effects of packaging on device performance
Microfabrication experience
- developed and optimized the following in-house wafer-scale processes
- photo-lithography with 5 μm minimal feature in 6 to 12 μm thick photoresist for 10:1 and 20:1 aspect ratio SOI fabrication
- two mask SOI process with aligned patterned metalization
- through wafer dry etching of vias for wafer-level packaging
- demonstrated skills
- processes: lithography, RIE, DRIE, wet etching, lift-off metalization, electroplating
- characterization: probe profilometry, optical confocal profilometry, SEM
- packaging: eutectic die attachment, wirebonding, lid sealing, vacuum packaging
Lab management
- identified equipment to improve lab research capabilities
- negotiated with vendors, carried out purchases totaling in ~$50k
Computer skills
- engineering software: L-Edit, MATLAB, Maple, Mathematica, MSC
- graphic design: Adobe Illustrator, Corel Draw
- programming languages: Java, C, C++, Visual Basic
- web design: HTML, JavaScript, CMS