alexandertrusov.com

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Research Experience

MEMS expertise

• dynamic MEMS devices and inertial sensors
• complete development cycle
  • conceptual development
  • design and layout
  • fabrication and packaging
  • experimental characterization
  • novel detection and control schemes

Experimental experience

• design and optimization of experiments for characterization of MEMS
  • dynamics in controllable pressue and temperature environment
  • deterministic and random drift performance
  • effects of packaging on device performance

Microfabrication experience

• developed and optimized the following in-house wafer-scale processes
  • photo-lithography with 5 μm minimal feature in 6 to 12 μm thick photoresist for 10:1 and 20:1 aspect ratio SOI fabrication
  • two mask SOI process with aligned patterned metalization
  • through wafer dry etching of vias for wafer-level packaging
• demonstrated skills
  • processes: lithography, RIE, DRIE, wet etching, lift-off metalization, electroplating
  • characterization: probe profilometry, optical confocal profilometry, SEM
  • packaging: eutectic die attachment, wirebonding, lid sealing, vacuum packaging

Lab management

• identified equipment to improve lab research capabilities
• negotiated with vendors, carried out purchases totaling in ~$50k

Computer skills

• engineering software: L-Edit, MATLAB, Maple, Mathematica, MSC
• graphic design: Adobe Illustrator, Corel Draw
• programming languages: Java, C, C++, Visual Basic
• web design: HTML, JavaScript, CMS